Base material
Various base materials such as standard FR4, halogen-free, high Tg, aluminium, 2 to 4 Oz copper, ceramics, polyimide, Teflon, etc. |
Number of layers
8-32 |
Surface
Chem. Ni/Au, Chem. Ni/Pd/Au, Chem. Ag, Chem. Sn, Galv. Ni/Au (hard gold), HAL (lead-free), HAL (containing lead) and OSP |
Color of the solder mask
Different colors |
Silkscreen
Different colors |
Material thicknesses
.008 Mil to .275 Mil (0.2 mm to 7.0 mm) |
Copper thickness
.0007 Mil (9 µm) to .0056 (3 mm) solid copper |
Maximum dimensions
47.24 inch x 19.69 inch (1200 mm x 500 mm)
|
Number of PCBs
From prototype to higher volume |
Special technologies
Rigid-flex, strippable varnish, carbon print, press-fit technology, other techniques |
Place of manufacture
China |
Global
Express service from 1 WD |